Type Nandpro /? at command prompt to get a list of all functions/commands
If your getting torn pads then your not reaching a balanced/high enough temp. Both board and chip should be of similar temps to get good pulls.
But you really need a bottom pre-heater, I've tried everything and nothing works like using a preheater.
I normally set my scottle ir6000's bottom heater to 235 deg C, run that for 4-5 mins, then my top heater kicks in, after approx 10 mins both reach same target temp of 225-230, which is good enough to reflow or remove chips.
I re-attach at a slightly lower temps as the melting point for leaded solder is lower, normally run it 2 times, reflowing with liquid flux the 2nd time.
Running a profile too fast will cause popcorning of the chip too, so nice and steady is the key.
Make sure your chip your working on is dry, so if you've cleaned it with alcohol or solvent then make sure you leave it to dry first, as this can also add to popcorning of the chip.
Then also running the temp too high or riseing the temp too fast can also cause this.
Try and use a few temp probs too, I only really have a basic setup at the moment, but I have two temp probs, one on bottom of the board, just off center, then the topside probe just touching the target chip and the board.