xboxscene.org forums
OG Xbox Forums => Modchip Forums => Team Xodus Chips (Xenium) => Topic started by: Dark Drake on December 02, 2004, 10:44:00 PM
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i recently baught a xenium ice and its going to be soldered. and cant determine whether i should pin head install or quick solder. im not the best solderer per say but im goin to practice up before it is delivered. my question is i have a 1.0 version xbox and the LPC holes are filled with solder any chance i dont have to remove this solder can i just install the modchip over this factory solder. thanks for the feedback. thanks alot.
Drake
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A pinheader installation is the better option, but you would have to remove the solder from the LPC holes first though.
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see im think quick solder is the way to go so that i wont have to rip up the mother board. get back to me.
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bump
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yes yes actually i do. cause this is a 175 dollar system and i dont want to go in and fuck everything up. im trying to get all kinds of opinions
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yea you really dont need two for it and so far my box is worth upwords of 500$ and if you are really concerned about messing it up go soderless
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cant do that.. heard solderless was a pain and more risky (slippage can cause mobo to fry.) so ill just go soldered
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Slippage? I've done a few xboxs with solderless adapters and really do NOT see how that could happen.
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I suggest quicksolder method, cause you can use the solder in the holes to connect the chip. But its gonna be a pain if you mess up and have to take chip out or plan on changing the chip later on.