Yes thats true but the problem is that the force applied from below is much higher because it is only this extremely tiny tip in the center that pushes it up.
So the pressure applied from below is like 16 times as high.
The temperature will sure have effects on the flexing process since it easier deforms when it gets hot but without the X-Clamps the temp flexing would only be temporary...
The fact that it is fixed to the case does not mean a thing since the board will just deform lower, there is enough room in between x-clamps and bolts, it is not fixed just as you said.
The chip doesnt stay solid it deforms as well I have seen this on a lot of mainboards...
And leadfree solder is used in everything today that was built in the last 4 years so we would see this phenomenon occur much more also for other devices....
An interesting thing to look at it is this ->
Tin Whiskers but this theory only fits for 0020 360s...
M$ also got a reputation to loose and if they would release to the public that it was such a small mistake that they couldnt fix in 3 years then a lot of angry customers would file law suits against them like in the past...
And M$ never wanted to make profits with this console they always sold it under price, it was just WIndows key to the living room...
Wilhelm