QUOTE(brandogg @ Jun 28 2007, 09:39 PM)

Isn't his problem exactly what the "heat gun trick" is for? You can try an X-Clamp replacement and heat gun trick all in one. Or if you can successfully heat the chip and reconnect the broken solder points, you can try putting epoxy on the sides of the chip to hold it in place, provided you test it extensively and it works for you. The epoxy *might* work, at least for a while, apparently MS had tried doing this before.
No, the "heat gun trick" is for people that have no clue what they're doing and like taking the chance they may ruin a board that may still have some life in it. If you want them reflowed properly then take it somewhere that has that capability.
If the thing is off the board that far you have 1 of 2 issues, possibly both.
1. The pads and or traces have been lifted with the BGA joint and that's not easily or cheaply fixed at all and sure as crap isn't going to be "magically" repaired by a heat gun.
2. The actual chip is most likely seriously bent in places it never should have been and could be damaged as well.
You can try the X-clamp replacement on it, but I wouldn't hold my breath on it ever booting again. What did you do to get it in that shape anyway? Just removing the heatsink (correctly) will not cause that kind of damage.