With the toothy Solderless adapter.. if you want to leave the filled LPC holes.. leave them filled. The Adapter literally digs into the filled holes.
If you want to removed the solder from the filled holes.. you might as well go all the way.. and do either a wire or pinheader install.
Fortunately.. there are alot more boards that have clean holes than filled holes. With clean holes.. fill with the included rivets... screw-down the solderless adapter.. and enjoy a trouble-free no-misalignment problem solderless solution.

If I sound like a broken record about the current Cham Solderless Wire loom adapter/Xenium Adapters.. it's because they WORK. and work well.
Course.. you use them.. you need to be able to find and identify the topside D0 for your particular board.
Despite multiple guides and references on XS.. and even the older CHAM and Current Xenium guides.. people will undoubtedly have issues finding or identifying the D0.. or worse.. (they might have poor vision) and not see it at all.
That's an advantage xecuter solderless solutions have.. as ithey are designed to align to whichever of the topside d0 you have (currently 2 different positions exist depending on your motherboard version)