The only thing that MIGHT save the new 360 reliability is the actual die layout on the new processor. If the processor heat is more even over the entire substrate then the heat stress will not be as severe. We know the failures are almost always the GPU, the CPU was small but usually ran just as hot if not hotter in many cases. I will forever stand by my theory about the black screws and case as there is no need for all that extra unbalanced pressure and I'm positive this attributes to the BGA stress even if the CPU could survive while the GPU could not. The only difference then between the CPU survival and the GPU failure is the actual physical architecture of the dies and substrate. So time will tell, I will sit back with my JTAGed Xenon and see what goes on with these new boxes.