Looks like it would work no problem, spare you having to heat up the other components on the board if you knew which chip was the issue. May cost more thought, but if you have access to all the gear then it be well worth it. Clearly they heat it to 150c first to pre-warm the chip and drive moisture out then heat it too 218c to force reflow, and at 218c other components tend to start melting (plastic covered bits, buttons etc.. Esp glue. I would definitely like to do this myself thought would need to use a laser probe for testing temperature since that camera thermo method would be expensive (laser surface temp probe expensive enough),.
Actually you can get most these things cheap, skip the camera crap since a laser probe will be more accurate then a visual check, and heating the chip up a couple degrees more won't kill it so to speak.
This post has been edited by PRiME2008: Yesterday, 03:54 AM