QUOTE(chadives @ Jul 17 2008, 07:33 PM)

I do realize that you dont need fresh solder to reflow, but you have also stated that it is the crap lead free solder that is the problem in the first place. I really hope that you have solved this problem with your method, however I am thinking about when I hook up my 20 year old NES and it acutually works! Would be nice to think that we could be able to do the same with our xboxs.
As far as reflow goes, toaster oven/ standard ovens will work with a good way to measure the temp, there are even mods on the net how to add a controller to a toaster oven for heat profiles. It would not be hard to achieve the proper heat profile manually either. Also there is wax that you can get that is made to melt once you have reached a certain temp for further physical feedback.
Just an idea I can't get out of my head, probably more trouble than it is worth. Only time will tell.
I will leave you alone on this one now that I know you are garunteeing your stuff for life. You must be very confident that your fix will last. Care to share what x clamp replacement you use? Probably a trade secret anyway

The problem is more complex and is caused by a queue of unfortunate coincidences, the lead free solder is only one of them.
In addition with the uneven pressure(depends on their location) that lasts on the solder balls and the fast cooling down after turning the 360 off, the lead free solder balls get cracks.This makes each 360 a ticking time bomb that will get certain hardware errors to occur at the time when the counter reaches zero...
If you take one of these 3 factors away you get rid of the whole problem if it was only the leadfree solder most PC video cards and other components that are manufactured with the use of BGA would have the same issues.
So if you take the X-Clamps away and find a way to put even pressure on the chip so that each solderball carries the same weight you removed the factor of the uneven pressure caused by the flexing and the issues will most likely almost never occur like in older consoles.
There are always systems that break but not as many as we have here.
You cant really delete the second factor which is the cooling process but you can reduce the time in which the solder balls get the cracks by cooling it down as much as you can, for example water cooling would keep it nearly at the room temperature if not lower.
And the last option would be to replace the lead free solder.
Replacing the X-Clamps is the most effective method though in my opinion as everything will break sooner or later if it flexes, the cool downs only support the effect that the flexing has on the solder balls.
Hope this made sense as I cant be arsed to read through this again

The wax you have been talking about there is quite a nice thing the only problem is that you will have to do it for a bit longer since most of the solder balls are under the chips and dont get the direct airflow that the wax was heated up with.
It would be quite interesting to see though so I think I will give it a go.
Do you have a link where you can buy this stuff?(if possible in the E.U)
I will make a tutorial when I am sure that it really works, I have tested it on 9 xboxes so far and the first one has been running for about 5 months now...
Am still improving it though, I already have something in my mind that I will try next time.