I don't think youre crazy, in fact I was looking up the melting point of lead free solder before I found this post. I had the same Idea too! I was even going to bake my motherboard when I got home from work.
In fact I'd say youre a smart individual in the troubleshooting department.
I would have done something differently though. 450*F only needs to be kept for 45 -60 seconds, and gradual cooling needs to take place.
This will be my baking profile:
4 min. 200 deg. Warm up board and allow temperatures to equalize.
2 min. 325 deg. Bring temperature up to saturation.
30 sec + 450 deg. Temperature raised until solder melts and beads at individual pins, and then held for 30 additional seconds.
Tap the cookie sheet before cool down... (IMG:
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I read recently that The EU dropped the hammer on electronics that have lead-solder in them, and didn't give manufacture enough time to adjust.
I bet some hasty decisions were made, and then they switched to the lead-free solder, the and some "know it all engineer forgot to set the proper heat on the reflow ovens, baking at lead-based solder temps.
Remember this too, the only reason Xbox one was #2 was because the Ps2 came out a year before the original console. So there was a rush to get it out there.
This post has been edited by Gizmo_duck: Dec 1 2007, 07:05 AM