MidKnightSecs
The really issue is not the heat, please guys! these chips can run well in these temperatures. When the Xbox was designed the soldering used was of such that is solder melt point was well over 200deg C so unless your running at 200C or more your problem is the not really heat!
But then again, heat causes expansion and contraction at high and lower temp, and this is were the system fails. It causes micro fractures under the chip ( mostly if not always the GPU ) screwing it tight is a fix if the fracture is really small, but since its there is WILL grow bigger!!!!!!
if you reflow the chip correctly, you did fix the problem, but not the reason for the problem, its still there and no X clamp upgrade will remove the reason for failure. NOTE!! overheating you xbox with a towl is not a reflow! heat-gunning it is also not a correct reflow but ,might work the solder melts at 217.C anything under that is a total waste of time and effort.
I have seen Xenon's running 24/7 at 90.C and are still working, since there is no expanding and contracting of components, there is no real reason for failure.
so without removing the reason for failure, no fix you do on your X-Box will ever really be fix your X Box