X-Clamp works for a lot of people, but you need to dig deeper into the problem and understand the cause and why X-Clamp works for some...
Most of the the X-Clamp related fixes are just adjusting the pressure on the BGA chip, either more presure from the heat sink, or less, effectively allowing better connection between the chip and PCB. This isn't a permenant fix imo. I have tried it and whilst it works for a period of time the RROD does come back. The only methods that can possibly resolve this permanantly is to resolder the BGA chip in question. By masking most of the PCB off using tin foil and just leaving a small window around the chip in question, you could use a hot air gun to get the chip close to the solders melting point, but... you stand the risks of A) cooking the chip, (IMG:
style_emoticons/default/cool.gif) damaging the PCB, or C) chip movement (I think this is unlikely, you would need all solder points to be at 217 degrees.
There are companies out there that provide BGA rework stations, but they cost around £6,000 as far as I can see. These do essentially the same as the hot air gun, but in a much more precise manner, time controlled, acurate temperature setting, bga head attachment that surrounds the chip and mates with the surface of the motherboard to reduce exposure to other components, supported by under PCB heating whilst the soldering completes.