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[pimpmaul69]

QUOTE(epsilon72 @ Apr 20 2007, 03:51 PM)

That's correct - if your display accepts 1080p through VGA, there's not that much point to having HDMI on the 360.

if you have a tv that uses hdmi wouldnt that mean you should be wealthy enough to buy a surround sound that supports fiber optic.. i have 5.1 dolby digital on games and dvds and dts on any dts film just fine through fiber optic

[89c4l98]

QUOTE(kidman64 @ Apr 20 2007, 02:33 PM)

thejt: so do you think there's a permanent fix for 3rol? or x-clamp replacement is the best we can do? (besides thermal paste etc)

It would be funny if M$ starts doing the x-clamp replacement on new 360's

[brywalker]

QUOTE(bucko @ Apr 20 2007, 04:28 PM)

That's cause the Elite is HDMI 1.2...

Total cop out. My Toshiba HD-A1 was only 1.2 and it played advanced codecs just fine.

It's a software thing. They need to upgdade the HD DVD player software.

The HD-A1 only did 2 channel True HD when it came out. Fixed in a firmware update.

I blame lazy coders, not hardware limitations. We don't even have DTS output for the 360 yet.

BTW, I wonder if they revised the SB to be able to read the DVD firmware....

[belke]

maybe if m$ took the money to get a new clamping device they would not only sell more 360's but save money on having to replace them..

[No.1 G]

QUOTE(nightmare84j28 @ Apr 20 2007, 02:28 PM)

Intresting! Maybe i should replace the thermal paste on mine and check for epoxy blobs too (mines a refurb)

Have you had any problems with your refurbished 360?

So far it's been good even tho soon as i received it i ripped it open and changed the thermal paste with AS5, but i only had the refurb unit for a week so lets see. My refurb unit was manufactured on 11/05, my original unit was manufactured on 10/06.

[darkmike57]

Does anyone know if the old hdd fits in the new case? And vice versa?

[forzadude2]

QUOTE(RBJTech @ Apr 20 2007, 02:58 PM)

What has the size of the chip case or the die heat spreader got to do with the size of the silicon wafer inside the chip ?  

The chip has the same number of pins which means it is the same physical size ...

The chip doesnt have a heat spreader in the animated gif.

QUOTE(RBJTech @ Apr 20 2007, 02:58 PM)

The only way we are going to know if it's 65nM is to measure the current drawn on the unit - fairly easy to do - (well difficult for me coz I don't have an elite...) - the other clue is the number of power regulators which I've already posted about - if they have halved the number, then it's a good bet the CPU and/or GPU needs half the power (or enough to justify a single rather than parallel regulators) ..

No, just lock at the size of the silicon. It's pretty easy to see that they have the same size.

[RBJTech]

QUOTE(forzadude2 @ Apr 21 2007, 11:43 AM)

The chip doesnt have a heat spreader in the animated gif.
No, just lock at the size of the silicon. It's pretty easy to see that they have the same size.

A heat spreader is a lump of metal that is used ON CHIP to spread heat to the HEATSINK.  The actual wafer of silicon is probably no more that 5mm x 5mm - therefore it is irrelevent what size the heat spreader is - we cannot see how small the silicon wafer is ...

[RBJTech]

QUOTE(thejt @ Apr 20 2007, 05:57 PM)

My personal opinion of the "clamps" is they are moot.  They only hold the heatsink to the board long enough for it to be placed into the steel cage.  They have absolutely no "clamping" value.  Now.. the studs that the clamps clip to DO.  These are crucial as they regulate the height of the mounted heatsink and provide ALL of the warp protection for the immediate area of the CPU/GPU (which is not enough).  

Can you explain this further  - from the drawing below (which is obviously just a respresentation of the device) the 'spring' in the X clamp clearly presses UP on the bottom of the mainboard, thus pressing the die onto the FIXED heatsink from underneath.  It's this single point of pressure directly under the die which allows the the outer perimeter to flex/warp due to heat - thus the OUTER BGU solder connections breaking - I think this was verified by some guys here with a BGU microscope tool.



I'd be interested in further views from Llama on this topic ...
   

[RBJTech]

Can SOMEBODY just measure the damn current draw on the Elite and compare it to the Premium  - please !

[mironicus]

Yes! What's about the power consumption of the new Elite vs. the old premium? No one posted any values yet.

[TGD]

QUOTE(jimbobjim @ Apr 20 2007, 04:57 AM)

My thoughts exactly. If they did replace them it would cause alot of people with currently working consoles to question how much longer it will be before failiure, and would probably result in many people calling M$ for a free x-clamp replacement.

IMO

Like what people? The thousands that are into the technical side of 360's hardware design or the millions that are considered the average consumer that dont know diddly squat what a BGA is or an xclamp?

I tell you what.. the majority of my friends that own 360's dont have a clue to what has went wrong with their 360 and dont have a clue to how wide spread this issue really is. Its the computer savvy people that will notice these kind of design flaws...not the general consumer that owns a 360.

 So i dont believe this is why MS didnt redesign their board,  i find your assumption quite funny actually..no pun intended bro.. heck, for all we know, this littlle change in the mobo, even the epoxy on the chips is good enough to fix the heating issues,warping,etc.. none of us know yet, only time will tell.

Peace