QUOTE(pimpmaul69 @ Apr 20 2007, 04:54 PM)
honestly i dont think the board warping is really a problem except that the x-clamps seperate the processors and heatsinks about 2 millimeters wich gives the processor room to lift...
In my observations, the X-clamps once removed are compromised. You need to apply alot of pressure to remove them and reattach them and they don't seem to go back aswell as they were from stock state. Your observations have come after you've removed and reattached them.
A 2mm seperation of heatsink from processors would cause overheating and shutdown.
People experience failure after months of perfect operation simply because thermal cycling causing board warp pushes and pulls the BGA chips to breaking point. The X-Clamps are certainly part of the problem that allows this to occur more readily but I don't agree with your assessment of what is happening. If the board was of better quality ie. more rigid and less susseptible to warp, the X-Clamps would suffice as is.
The boards do warp and thats the problem that we always come back to. If that problem goes away, then all of the other things that aren't quite up to scratch, like the excessive heat and the mounting become less problematic.
Amazing what a little bit of heat can do to poor quality PCB - http://www.youtube.com/watch?v=CQgLBD3F6Bg