You will not stop thermal expansion with a bit of epoxy - or bolts for that matter, they will just split the board as the weakest link if there is no 'give'.
I don't think anybody truly knows what's causing these solder joints to fail (yet, lots of theorys..) but if it is thermal movement, then making sure the board moves with the chip sounds a better long term solution that trying to fix it all down ?
To minimise thermal expansion of the chip and board in the first place also seems like the best solution - better cooling - there are obviously plenty of 'mods' for keeping the die of the chip cool - but I think I am the only person to date to implement 'underboard' cooling...
You would be
amazed at the amount of heat generated from UNDER the motherboard - I have a radial fan extracting heat from inbetween the two X-clamps (via a 40cm hole cut in the case itself) - the air it extracts is easily as hot as the main exhausts, which IMO, means under the board without this forced extraction is getting rather hot ...

My theory here, is to keep both the chip AND the board and all it's
soldered BGA connections as cool as possible to minimise thermal expansion.
If anybody is interested in seeing this setup, then let me know and I'll do some diagrams/pics - there is a pic of the fan in some of my threads, but none on the construction and how it works ...
Regards, Richard.
I did your fan mod under the xbox. I used a 70mm fan though. blowing into the box. here's the link
I originally had it at 12v but it was wayy too loud, so I switched it to 5v and its much quieter now. the box is very cool now. gaming discs don't even get warm now.
My idea about putting something on the heatsink was just what dokworm was saying. I just wanted a little dab on the corners ,right where the chip meets the heatsink, just to keep it connected to the M/B.