Yes this is a manufacturing problem, but it is result of not using lead base solder. Ever since RoHS many companies are having issues manufacturing electronic equipment, because this is all new territory. Manufactures have been using lead solder since the begining of CPUs, the new laws have force many experimental process, and as a result issues have resurfaced that had been priviously solved.
Dam Europe and their green laws have made it harder for everyone. As a matter fact even a nuclear facility has been plagued by these problems, and these facility are suppose to be built on the most tested and reliable equipment in the world.
Stop blaming MS, it is the result of force evolution by governments.
here is info:
http://en.wikipedia.org/wiki/RoHS.
Good info but there are quite a few reasonable alternatives, it's not like they didn't know that they'd have to change over.
Also if non-lead solder was such a problem MS could have easily gone with a different solution, like a mechanical connection as opposed BGA.